Issue link: https://docs.hic.us/i/445631
198 To set details of optional device Chapter 8 PT10 2. To set details of optional device 2-1. Sequin Device III The detail of the device will be set. 2-1-1. Explanation on the screen [a] Feed amount of sequin chips for each device L1 and L2 at the left side (refer to the right figure) Select a value that adds about 1.0 to an external diameter of chip as a rough standard. [b] Feed amount of sequin chips for each device R1 and R2 at the right side (refer to the right figure) Select a value that adds about 1.0 to an external diameter of chip as a rough standard. [c] Insertion of jump data when a sequin chip is sewn on Select "YES" when sequin chips are not sewn effectually. However, productivity will be decreased. YES: To perform NO: Not to perform [d] Moving up of device at frame stepping YES: To perform NO: Not to perform Selecting "NO" will increase manufacturing efficiency. However, the device could interfere with the frame resulting in its breakage depending on design or frame type to use. [a] F3 2.0 4.0 4.0 ---L1------ 2 Sequin 9.9 [mm] NO YES/NO Jump insertion YES Device Up at YES/NO L2--------- 4.0 ------R1--- 4.0 ---------R2 2.0 9.9 [mm] 2.0 9.9 [mm] 2.0 9.9 [mm] Setting of device at the left side [b] Setting of device at the right side [c] Jump insertion [d] Moving up of device frame stepping Left side L1 L2 Right side R2 R1 ! CAUTION